Epoxy resin Potting compound WOC-87-II(A)/2125(B)
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■ Description
Two-component encapsulating system based on epoxy resin,formed from auxiliaries including epoxy resin, diluent, compound amine, cross-linking agent and defoamer by special production processing
Excellent of the surface gloss of the cured epoxy resin, excellent electrical properties and have flame retardant property.
■ Applications
Encapsulation of electrical components of Capacitor, Igniter, Transformer, trigger and Filter.
■ General properties
|
Test Item |
Test Mothed/Conditions |
WOC-87-II A |
2125 B |
|
Appearance |
Visualization |
White viscous liquid |
Slight yellow transparent liquid |
|
Density |
25º C g/m³ |
1.58 – 1.70 |
0.95 – 1.10 |
|
Viscosity |
40º C mpa.s |
1000 - 5000 |
20 - 50 |
|
Viscosity(blended) |
40º C mpa.s |
500±200 |
|
|
Storage validity |
Sealed and storage Temp.below 25º C |
6 months |
6 months |
|
Ratio of blend |
Weight/Weight |
100 |
20 |
|
Curing condition |
º C/hrs |
25 º C/24h or 60 º C/3h |
|
■ Characteristics after curing
|
Item |
Unit/Conditions |
WOC-87-II A/2125 B |
|
Hardness |
20º C Shore-D |
＞70 |
|
Insulation Strength |
25º C kv/mm |
≥17 |
|
Bending Strength |
Kg/cm2 |
≥82 |
|
Heat/cold Shock Resistance |
-20 to 80º C |
Cycle times: more than 8 |
|
Flame Retardancy |
UL 94 |
V0 or V1 |
|
Surface Resistance |
25º C Ω.cm |
＞1014 |
|
Volume Resistance |
25º C Ω.cm |
＞1015 |
|
Curing Shrinkage Rate |
% |
＜0.6 |
| Industry Category | Chemicals/Adhesives-Sealants |
|---|---|
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